Send Message
Yixing Minghao Special Ceramic Technology Co., Ltd.
products
products
Home > products > 95 Alumina Ceramic > 95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

Product Details

Place of Origin: CHINA

Brand Name: MH

Certification: ISO9001 RoHS

Model Number: MH01

Payment & Shipping Terms

Minimum Order Quantity: 500 PCS

Price: USD 0.1-3PCS

Packaging Details: CARTON/WOODEN BOX

Delivery Time: 15-20DAYS

Payment Terms: L/C, T/T, Western Union

Supply Ability: 5000 PCS WEEK

Get Best Price
High Light:

95% direct bonded copper substrate

,

ROHS direct bonded copper substrate

,

ceramic substrate 300Mpa

Material:
95% Alumina Ceramic
Color:
White
Density:
3.6 G/cm³
Certification:
RoHS ISO9001
Hardness:
10.7 Gpa
Size:
Customers' Requests
Flexural Strength:
300 Mpa
Thermal Conductivity:
25 W/(m.k)
Insulation Breakdown Intensity:
18 KT/mm
OEM,ODM:
Accept
Material:
95% Alumina Ceramic
Color:
White
Density:
3.6 G/cm³
Certification:
RoHS ISO9001
Hardness:
10.7 Gpa
Size:
Customers' Requests
Flexural Strength:
300 Mpa
Thermal Conductivity:
25 W/(m.k)
Insulation Breakdown Intensity:
18 KT/mm
OEM,ODM:
Accept
95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

 

Copper coated DBC ceramics substrate with Gold-plated

 

Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.
 
1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

 

Properties Unit Steatite ceramic 95% Al2O3 99% Al2O3 Zirconia Ceramic
Density g/cm³ 2.8 3.6 3.8 5.6
Flexural strength Mpa 145 300 300 354
Max Working Temperature 1100 1400 1600 1400
Sintering temperature 1350 1700 1750 1550
Heat resistance T(℃) 200 220 200 350
Hardness Gpa 5.7 7 10.7 12.3
Elastic modulus Gpa 120 275 320 205
Poissons ratio - 0.21 0.22 0.22 0.30
Linear expansion coefficient x 10-6/℃ 7.9 7.1 7.8 9
Insulation breakdown Intensity KT/mm 10 16 18 15
Thermal conductivity w/(m.k) 2.5 20 25 2.5
Specific Heat *10-3J/(kg*K) 0.75 0.78 0.78 0.4

 

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated 095% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated 195% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated 2

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated 395% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated 4

 

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated 5